Stacked Structure
Technology
Common Technology of Image Sensors

Stacked Structure

Overview

In place of a supporting substrate for the back-illuminated CMOS image sensors, a chip on which a signal processing circuit has been formed (circuit section) is used. Stacking it under the pixel section (stacked structure) makes it possible to mount a large-scale circuit on a small chip.

Overview

Technical Features

Pixel section and circuit section can be manufactured by the best processes for each of them

Since each section is formed on a separate chip, specialized manufacturing processes can be used to produce a pixel section with high image quality and a circuit section with high performance, enabling higher image quality, multi functionality, and a compact size.

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