Stacked Structure
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Overview
In place of a supporting substrate for the back-illuminated CMOS image sensors, a chip on which a signal processing circuit has been formed (circuit section) is used. Stacking it under the pixel section (stacked structure) makes it possible to mount a large-scale circuit on a small chip.
Technical Features
Pixel section and circuit section can be manufactured by the best processes for each of them
Since each section is formed on a separate chip, specialized manufacturing processes can be used to produce a pixel section with high image quality and a circuit section with high performance, enabling higher image quality, multi functionality, and a compact size.
Related Products & Solutions
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Image Sensor
Image Sensor
Find out more about image sensors with this technology.
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