Cu-Cu (copper-copper) connection is a technology for directly connecting pixel chips and logic circuit chips of stacked CMOS image sensors using copper terminals formed on their respective stacked surfaces. This eliminates the need to provide connecting components that penetrate pixel chips, and since specialized connection areas are not necessary, image sensors can be made even smaller in size with higher productivity.
Improved freedom in terminal layout and higher density
Cu-Cu connection does not require a specialized area for connecting pixel chips and logic circuit chips as with conventional TSV connection, so it can allow greater freedom in terminal layouts as well as higher density. It will contribute to the advanced functionality of stacked CMOS image sensors in the future.
Related Products & Solutions
Find out more about image sensors with this technology.
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