MEMS Foundry Service
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Overview
Sony Semiconductor Solutions Corporation will utilize the MEMS/semiconductor processing technology it has cultivated over many years as well as its proven results in MEMS commissioning, to provide consistent, comprehensive MEMS foundry services from prototyping to mass-production. We will support the MEMS development and production needs of our customers.
・Foundry services
Wafer process development (development, engineering samples, low ~ high volume mass production)
・Available processes
Bulk process (including SOI), surface process, semiconductor process.
・Fab Location
Sony Semiconductor Manufacturing Corporation, Kagoshima Technology Center
・ISO Certifications
ISO9001、ISO14001
MEMS Foundry Customer Engagement Flow
*) This timeline is only a guideline, so be aware that it may change depending on products or development items.
JDA: Joint Development Agreement
WSSA: Wafer Supply & Services Agreement
Features
Services and equipment
MEMS Foundry service (as of Apr.2022) | |
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Location | Kirishima City, Kagoshima Prefecture, Japan |
Clean class | Class 1-1000 |
Wafer size | 8inch |
Production capacity | Small volume engineering samples - mass production |
Services | Process optimization, Engineering samples, Mass production |
ISO, etc. | ISO9001, ISO14001 |
Development / Production experience | various sensors, actuators, optics |
Process technology | Bulk processing including SOI, Cavity-SOI, Surface processing |
Equipment | |
---|---|
Photolythography | Stepper, Double sided aligner, Coater, Developer |
Heat treatment / diffusion | Diffusion, Ionic diffusion |
Deposition | LPCVD, PCVD, Sputter, Vapor deposition, Doped Poly, Epi Poly |
Dry etch | RIE, DeepRIE, Asher |
Wet etch | HF, KOH, Resist removal |
Cleaning | RCA, Organic cleaning |
Other | Plating, Lift off |
LowStress SiN, LowStress Poly, LowStress Epi Si | |
Epi | |
Design / Analysis | Analysis environment |
Measurement / Evaluation | MEMS measurement, Evaluation environment |
Support for handling a wide range of materials

Process technologies
We can also accommodate various other device structures, so please consult with us as necessary.
◆TSV (Through Silicon Via)
One type of mounting technology, which refers to an electrode that vertically penetrates the interior of a silicon chip. If multiple chips are to be stacked and fit into a single package, connecting upper and lower chips to each other with this penetrating (through) electrode can be expected to reduce package sizes and improve reliability.
Features
・High aspect ratio TSV
・High-density TSV
◆WLP (Wafer Level Package)
Wafer bonding technology can reduce the size of MEMS chips that contain packages.
Features
・Au - Si Eutectic Bonding
・Vacuum Sealing
・Au - Au Bonding
・Glass Frit Bonding
・Resin Bonding

◆Deep RIE Process
“Deep RIE” refers to one type of reactive ion etching (RIE) that has a high aspect ratio (narrow and deep). Due to this characteristic, it is also known as “high aspect ratio etching.”
It is a leading type of production technology for bulk micromachining of MEMS.
Features
・High aspect ratios
・Various taper angles
・Filling



◆Epi Poly Process
It is possible to form an Epi Poly layer on a structure and then form other additional structures, so complex device configurations can be created.
Features
・Thick Poly-Si
・Low-resistance Poly-Si
・Low-stress Poly-Si

Contact Us
For inquiries about Sony Semiconductor Solutions Group and products / solutions, specifications, quotation / purchase requests, etc., please contact us using the Inquiry form from the button below.