Product photo of X-ray image sensor IMX711
Products
Image Sensor for Scientific Use

X-ray Image Sensor

Integration type X-ray sensor achieving ultra-high-speed and low noise performance
Enhancing efficiency and advancement in elemental and structural X-ray analysis

Overview

The IMX711 is an X-ray image sensor that employs a direct conversion and integration type CMOS technology, in which X-rays and electron beams are detected directly.
It uses proprietary technology to achieve both high-speed capture and low noise performance, enabling the detection of weak single-photon signals*1, which is difficult with conventional integration type sensors.
This technology enables measurement with a wider dynamic range than conventional methods, offering from single-photon detection under low-flux conditions to stable and high-accuracy measurement in high-flux conditions.
The image sensor can capture energy, spatial, and temporal information simultaneously, which contributes to better measurement accuracy, measurement throughput, and flexible post-processing depending on the application and use casein advanced device inspection and scientific measurements such as materials science and life sciences.

*1) The IMX711 was developed with the collaboration between Sony Semiconductor Solutions Corporation and RIKEN. Based on a pixel structure invented by Dr. Takaki Hatsui of RIKEN, the two parties worked together on the technological development required to make it viable as a practical X-ray image sensor, including improving sensitivity and achieving high resistance to X-ray irradiation and high-voltage tolerance. Sony developed its circuit technology, manufacturing processes and packaging technology for mass production.

Features

Achieves the industry’s top class*2 of high-speed capture with low noise performance

Using proprietary technology, the IMX711 achieves the industry’s top class of high-speed capture performance for integration type X-ray image sensors as well as extremely low random noise performance.
In the field of X-ray measurement, two methods are used for different purposes: the photon‑counting method, which detects and counts individual X‑ray photons, and the charge‑integrating method, which integrates the total signal over an integration period. The photon-counting method is well suited for detecting signals under low-photon-flux conditions, as the noise can be suppressed using thresholds discrimination. By contrast, the integration method is well suited for high-flux conditions, as the signal is accumulated.
The IMX711, using the high-speed capture and low noise performance achieved through joint development with Dr. Hatsui Takaki’s lab at Riken, Japan, enabling the detection of weak single-photon signals, which is difficult with conventional integration type sensors.

*2) Among integration type X-ray CMOS image sensors, according to Sony research (as of announcement in June 2026).

Utilizing photon energy information under low-flux-conditions

The IMX711 enables single-photon detection at low X-ray energies thanks to its low readout noise, whereas such signals are typically buried in electronic noise in conventional integrating detectors. Its low-noise, low-variation readout also provides high energy resolution, enabling effective use of photon energy information in analysis.
Since no threshold-based energy filtering is required prior to measurement all photon energy information is retained and used in downstream analysis.
This enables the selection of energy ranges freely according to various purposes from a single measurement dataset, improving analysis efficiency and advancing analytical capabilities.

Diagram explaining data output under low-flux conditions
Diagram explaining data output under low-flux conditions
ZoomZoom

Capable of obtaining data with linear response even under high-flux conditions

Because the IMX711 is an integration type sensor, it does not suffer from photon counting loss as is seen with photon-counting sensors. Instead, it can maintain a linear response even under high-flux conditions.
Further, because high-speed capture allows for a lower signal storage capacity per frame, it can reduce signal saturation compared with the conventional integration method.
Utilizing this signal output and gain information during readout means that subsequent digital processing allows for data reconstruction across a wide dynamic range, with consistent signal handling from low to high flux.
This contributes to the acquisition of high-reproducibility and high-accuracy measurement data, even in X-ray measurement with pixels of significantly different incident intensities existing simultaneously within a sensor.

Diagram explaining data output under high-flux conditions
Diagram explaining data output under high-flux conditions
ZoomZoom

Specifications

IMX711-AABY
Image size Diagonal 59.8 mm (Type 3.73)
27.88 mm (H) × 52.85 mm (V)
Number of active pixels 384 (H) × 728 (V) - 16*1
Approx. 0.28 megapixels
Unit cell size 72.6 μm (H) × 72.6 μm (V)
Substrate material Silicon
Sensor thickness 650 μm
Frame rate
(All-pixel readout)
26.1 k fps (Mode-A)
17.4 k fps (Mode-C Cont, HDR)
Noise Typ 34 e-rms*2
Max 60 e-rms
Saturation count rate (12keV) 0.94 Mcps/pixel (Mode-A)
33 Mcps/pixel (Mode-C Cont)
600 Mcps/pixel (Mode-C HDR)
Output interface SLVS-EC
Package Chip Size Package (CSP) : 30.36 mm (H) x 69.74 mm (V)
PDF PDF

*1) Black pixels
*2) Typical value, averaged from measured values of active pixels at Tj = 20℃.

Sensitivity characteristics of X-ray

Graph showing X-ray sensitivity characteristics of IMX711
Graph showing X-ray sensitivity characteristics of IMX711
ZoomZoom

Application

Simultaneous crystal structure and elemental analysis

When developing a new battery or semiconductor material, it is essential to understand the atomic structure and the elemental composition of materials.
Conventionally, it has been necessary to measure each of them separately, using different detection equipment, but IMX711 now makes it possible to analyze both the structure and the composition in one single measurement. For example, when analyzing the crystal structure of battery materials, the elemental composition can be evaluated simultaneously. This significantly streamlines the analysis workflow.

Data from simultaneous crystal structure and elemental analysis
Data from simultaneous crystal structure and elemental analysis
ZoomZoom

The IMX711 can acquire energy values for each individual photon, enabling simultaneous measurement of the X-ray energy spectrum (b) and the scattered intensity distribution from the material (c). By utilizing this information, it becomes possible to estimate the crystal structure (d) with compositional information.

High-accuracy crystal structure analysis without metal filters

In X-ray structural analysis, unwanted wavelength components—such as fluorescence X-rays emitted from the sample or the X-ray source—act as noise and degrade the quality of diffraction measurements.
Conventionally, these noise components have been suppressed by adding metal filters. However, such filters also attenuate the required X-ray wavelengths, resulting in reduced measurement efficiency.
The IMX711 enables extraction of the required signals through post-processing of the measured data, eliminating the need for filters and contributing to high-precision measurements without loss of X-ray intensity.

Data from high-accuracy crystal structure analysis without metal filters
Data from high-accuracy crystal structure analysis without metal filters
ZoomZoom

The IMX711 acquires energy values for individual photons with high resolution, enabling removal of wavelength components that interfere with analysis in X-ray diffraction measurements. While signals such as the Cu-Kβ line are included when using the full energy range, selective data processing using only the required Cu-Kα line is possible for analysis.

Elemental color mapping

The IMX711 acquires energy values for individual photons with high resolution, enabling discrimination between elements with similar characteristic energies, as well as materials with similar absorption properties.
In addition to fluorescent X-ray analysis, this sensor enables elemental mapping using radiography (2D) and X-ray CT (3D) imaging.
It can be applied to a wide range of applications, including identification of trace elements and their spatial distribution in defect analysis, as well as investigation of underdrawings in artworks.

Data from elemental color mapping
Credit: RIKEN, Japan
Data from elemental color mapping
ZoomZoom

Credit: RIKEN, Japan

Improved efficiency in thin-film material analysis

In X-ray reflectivity measurements used for evaluating the quality of thin-film materials in semiconductor applications, reflected X-ray intensity from the film surface is measured to assess film thickness, density, and surface roughness with nanometer-level accuracy. These measurements require capturing both strong specular reflection curves and weak scattering signals, and conventionally have required multiple measurements under varying conditions.
The IMX711, with its wide dynamic range, enables data acquisition across the full angular range in a single measurement. This significantly reduces measurement time and improves quantitative accuracy by enabling measurements to be performed under consistent conditions.

Data from thin-film material analysis

This graph shows the X-ray reflectivity curve obtained with the IMX711, along with a curve fitted using a theoretical model.
Measurements were performed using a Cu-target rotating anode X-ray source (9 kW).
The fitted curve agrees well with the experimental data, demonstrating that X-ray intensity spanning up to approximately eight orders of magnitude can be measured with high accuracy.

Related sectors

Semiconductor Manufacturing

Improved measurement efficiency in high-speed inspection of moving objects

In inspection processes for semiconductor and battery manufacturing, stable image acquisition is required even under high-speed operating conditions, such as during material transport or stage movement.
The IMX711 combines high-speed capture with low-noise performance, enabling high-resolution image acquisition even in moving environments. This contributes to both improved inspection accuracy and increased throughput.

Image from high-speed inspection of moving objects
Subject SD card
Rotation speed Rotating at 2 revolution/s
Moving at 70 m/min
X-ray source Target element: Mo (molybdenum)
Tube voltage: 40 kV
Tube current: 140 mA

Captured at 17.4 k fps

Credit: RIKEN, Japan

* Sales are restricted to "Group A" countries/regions under Japan's Export Trade Control Order, Appended Table 3.

Download

IMX711-AABY Product overview

This document summarizes the product overview, features, and specifications.

Contact us

Inquire about products and services

Contact us

* This button will redirect you to the salesforce.com Co., Ltd. website,
which we have entrusted.