Development, Design, and Production Initiatives
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The outline flow from planning to mass production of CMOS image sensors
STEP 1 Product Planning
Determine "what kind of product (device) to make" based on customer needs and business plan
STEP 1 Core Technology Development
New development of basic technologies such as materials, pixel structures and drive mechanisms to improve function and performance
STEP 2 Specification Review
Review specifications of image sensors as well as lenses implemented together
In cases where existing technologies and materials can’t meet the needs of our customers, we will start by developing the necessary elemental technologies.
STEP 3Design
· Design the circuits of functional aspects as a image sensor such as a drive timing, interfaces and image processing
· Design pixels and readout circuits
Stacked CMOS image sensor design flow
Pixel section chip
Specification Review
Define pixel function implementation and connection with circuit section
Circuit section chip
Specification Review
Define functionality and implementation of pixel readout, signal processing circuits, and connection with pixel section

Circuit Design
(Pixel/Analog Circuits)
To meet specifications, design photoelectric conversion/drive structures; design image signal readout circuit and so on

Circuit Design
(Logic/Analog Circuits)
Design each functional block that will meet defined specifications as a logic or analog circuit

Simulation & Verification
Verify that circuit design results match defined specifications

Simulation & Verification
Verify that circuit design results match defined specifications


Overall Verification
Confirm through simulation that no functional issues arise when both sections are combined



Layout Design
Convert circuit design into physically manufacturable element and wiring layout data

Layout Design
Convert circuit design into physically manufacturable element and wiring layout data

Layout Verification
Confirm that layout design results meet performance and characteristics criteria as designed

Layout Verification
Confirm that layout design results meet performance and characteristics criteria as designed


Overall Verification
Superimpose layout data of both sections to confirm connection of both sections


STEP 4Prototyping
Prototype an image sensor based on the design.
STEP 5Evaluation
Shoot various targets in a dark room, etc., and check whether the functions are as specified and whether the images are shown correctly.
STEP 6Preparations for Mass Production
Measure the image sensor with a tester to obtain the data required for mass production. In addition, check if it operates correctly even in a high or low temperature environment and outputs an image.
STEP 7Mass Production
Reflect the feedback from the mass production preparation on the production line, and mass-produce the image sensors.
Production
Wafer processes (Front-end processes)

Substrate Process
Photodiodes and other elements that convert incident light into charge are formed on silicon wafers


Wiring Process
Each element formed in the substrate process is connected with metal wire


Stacking Process
Pixel wafers and outsourced logic circuit wafers are stacked


On-chip color Filter Process
Color filters that transmit each RGB light and on-chip lens are formed over pixels


Wafer Measurement Process
Product quality and reliability is confirmed in the wafer form
Assembly processes (Back-end processes)
Dicing Process
Silicon wafers are cut into individual chips (dice)

Die/Wire Bonding Process
Chips (dice) are glued onto a metal lead frame, and electrodes are connected with a metallic material

Mold Process
The package is sealed with a resin sealant

Assembly Measurement Process
Product quality and reliability is confirmed in the diced chip form

Packaging, Shipment
Products are shipped to customers
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Sony Semiconductor Solutions Corporation (SSS) solves customer challenges with various semiconductor products and solutions that make full use of industry-leading advanced technologies centered on imaging and sensing technology.
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