Applications
Manufacturing

Semiconductor Manufacturing

Overview

Semiconductors are utilized in a variety of electronic products from household appliances to social infrastructure, and their performance is constantly evolving. Semiconductor manufacturing processes are built on a foundation of stringent quality control. Quality inspections for each of these processes not only guarantee product quality, but also greatly impact the productivity of each piece of manufacturing equipment. It is necessary to speed up image inspections to improve the productivity of semiconductor manufacturing equipment. Now we face rising expectations to the improved performance of image sensors as the key devices of machine vision, since the trend of miniaturization in process rules is accelerating year by year.

Applications

Flaw inspections

Precise inspections are carried out to detect minute foreign material and pattern flaws that occur in the semiconductor wafer and photomask manufacturing processes. UV image sensors detect minute flaws such as those found in semiconductor patterns, with their imaging performance in short wavelength. Sony’s IMX487 high-definition UV image sensor realizes both high sensitivity and low noise, making it capable of high-precision inspections.

Flaw inspections

Positioning

In the field of high-performance semiconductor manufacturing, there is a process of joining wafers to wafers. As device miniaturization accelerates, the demand for alignment accuracy between wafers is increasing. SWIR image sensors make it possible to observe through the silicon (Si) part of wafers, allowing positioning marks to be checked with clarity. Moreover, the high-definition image quality of these sensors allows edges to be detected with high precision, enabling accurate positioning.

Global shutter image sensors are also used for positioning due to their high-definition performance. These sensors have high reputation for their shorter TAT (Turn Around Time), improved accuracy due to the high resolution, and for their high reliability.

Positioning

Wire bonding

Wire bonding is one of the main processes of production of semiconductor products, which is to electrically wire semiconductor elements to substrates. Silicon chips, the core of semiconductor products, are wired to the substrate using metal wire (bonding wire) of several tens of micrometer in diameter. High-speed, high-resolution global shutter image sensors are used to accurately and quickly carry out minute bonding inspections.

Wire bonding

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